Gelid Solutions Gp-Extreme heat sink compound Thermal pad 12 W/m·K

Name: Gelid Solutions Gp-Extreme heat sink compound Thermal pad 12 W/m·K
Brand: Gelid Solutions
SKU: TP-GP01-A

Gelid Solutions Gp-Extreme heat sink compound Thermal pad 12 W/m·K thumbnail

Preisalarm

Gelid Solutions GP-Extreme. Type: Thermal pad, Thermal conductivity: 12 W/m·K, Product colour: Grey. Width: 80 mm, Depth: 40 mm, Height: 0.5 mm. Quantity per pack: 1 pc(s)

★ 4.9

10,00 €

Historisch niedriger Preis!

Bester Preis bei amazon.de

Preisalarm

Gelid Solutions GP-Extreme. Type: Thermal pad, Thermal conductivity: 12 W/m·K, Product colour: Grey. Width: 80 mm, Depth: 40 mm, Height: 0.5 mm. Quantity per pack: 1 pc(s)

★ 4.9

10,00 €

Historisch niedriger Preis!

Bester Preis bei amazon.de

Preisalarm

Gelid Solutions GP-Extreme. Type: Thermal pad, Thermal conductivity: 12 W/m·K, Product colour: Grey. Width: 80 mm, Depth: 40 mm, Height: 0.5 mm. Quantity per pack: 1 pc(s)

★ 4.9

10,00 €

Bester Preis bei amazon.de

Preisalarm

Gelid Solutions GP-Extreme. Type: Thermal pad, Thermal conductivity: 12 W/m·K, Product colour: Grey. Width: 80 mm, Depth: 40 mm, Height: 0.5 mm. Quantity per pack: 1 pc(s)

★ 4.9

10,00 €

Bester Preis bei amazon.de

Preisdetails

Der niedrigste Preis für ein neues Gelid Solutions Gp-Extreme heat sink compound Thermal pad 12 W/m·K beträgt 10,00 €. Dies ist derzeit das günstigste Angebot aus 2 Shops.

Produktinformationen

The GP-Extreme is designed to provide perfect thermal contact to the heatsink when installed on PCBs with height differences and uneven surfaces such as micro-controller units, memory ICs, analog ICs and other SMD components. Thanks to its softness and ultimate thermal conductivity the GP-Extreme fills spaces properly and offers the best performance in class. The GP-Extreme is nonelectrical conductive, non-corrosive, non-curing and non-toxic. The GP-Extreme ensures an easy application and the thermal pad dimensions of 80×40 mm optimally fit to large PCB surfaces of VGA cards, high-speed HDDs and other densely packed devices.